產品說明
High-Accuracy Twin-Head Die Bonder
- High-accuracy bonding by unique 3D-NRS technology
- High-productivity and space-saving footprint by adopting twin-head
- High-speed thin die pick-up system with a speed of 400ms / t:20um(option)
*Depending on material conditions - Friction-free bonding head with simultaneous positional and force control for thin die stacked devices
- Cleanness control with HEPA-filter and stainless steel full cover
- Equipped with die back-side camera on each bonding head, enhancing inspection function with a total of 8 cameras
- Capable of handling large substrates up to 120mm width x 300mm length
Specification
ITEM | DETAILS | |
Product Name | Die Bonder | |
Model | SPA-1000 | |
Bonding Method | DAF bonding | |
Accuracy | XY:±5μm (3σ)、θ:±0.05°(3σ) (Machine accuracy excluding material-induced factors) | |
Productivity | The productivity increased by 2.5 times compared with conventional model. (Theoretical value with Shinkawa's standard sample) |
|
Chip Size | □0.8 – 25mm | |
Wafer Size | Maximum 12-inch | |
Substrate/Leadframe Size | Width | 40 – 120mm |
Length | 180 – 300mm | |
Thickness | 0.05 – 0.8mm | |
Options Available | Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT) | |
Utilities | Input Power Supply | Single Phase AC200V±5% 50/60Hz (Other power supply options available on request) |
Power Consumption | Maximum 3.2 kVA (3.2kW) | |
Air | 500kPa (5kgf/cm2) 900 L/min | |
Vacuum | Below -74kPa (-550mmHg) (gage) | |
Physical Dimensions and Mass | Approx. 2,280W × 1,510D × 1,670H mm Approx. 2,300 kg (excludes monitor display and signal tower) |
※ Configuration and specifications of this machine are subject to partial modification without prior notice.