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  • UTC-5000NeoCu 1
  • UTC-5000NeoCu

UTC-5000NeoCu

產品說明

High Speed Cu Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices.

  • Capable of handling bare Cu wire and Pd coated Cu wire, achieving high speed bonding of 45ms/2mm
  • Capable of high quality bonding with QFN devices and heavy Cu wire by installing a bonding head with a maximum bond force of 1000gf and high rigidity transducer
  • Shorter product-type changeover time achieved by digitalizing the flow rate of inert gas
  • Equipped with electric flame-off unit capable of handling wire sizes φ15-50μm without changing unit
  • Enhanced portability with self-diagnostic function that optimizes servo parameters
  • Capable of indexing 95mm x 300mm lead frames by allowing Y bonding area of 87mm
  • Minimum detectable capacitance of 1pF achieved by AC nonsticking detector, allowing more advanced high precision nonsticking detection
  • Capable of handling various types of devices with a variety of loop modes using Shinkawa ICP multi-loop mode technology and loop locus stabilization (XYZ control)(※)
  • Facilitating the optimization of bonding parameters by automatic free air ball size setting
  • Prevention of misplaced bonding by automatic bonding monitor function (BIM: Ball Inspection Measurement) that measures ball size and position, and feeds back information on positional deviation
  • Correction of variations in ultrasonic output among machines by US current auto-correction function (UCAC)(※)
  • Automatic free air ball monitor function (FAM) measuring free air ball size
  • Capable of stable 35 μm pad pitch bonding with low vibration, high-speed drive using Shinkawa NRS technology
  • Position correction function using temperature detection added to capillary tip position automatic correction through Shinkawa’s RPS technology(※)
  • Maintenance work facilitated by automatic clamper calibration(※)
  • Capable of handling large-size magazines by use of magazine stacker system
Specification
ITEM DETAILS
Product Name Wire Bonder
Model UTC-5000NeoCu
Bonding Accuracy  ±2.0 μm(3σ)Using Shinkawa standard device
Correction of Bonding Position System to check and correct capillary offset prior to bonding through Shinkawa RPS
(In combination with offset amount correction with temperature detection)(※)
Bonding Speed 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
Bonding Wire Length 8 mm maximum (Varies depending on device conditions)
Resolution XY-table: 0.1 μm  Z-axis: 0.1 μm
Vibration Control Shinkawa NRS - Non Reaction Servo System
Bonding Area X:±28 mm, Y:±43.5 mm
Wire Size Au / Cu φ15–50 μm
Bonding Force 3–1,000gf
No. of Bonding Wires 30,000 wires maximum
Loader/Unloader Fully automatic magazine stacker system (Option: stocker system)
Workpiece Size Width 20– 95 mm (20–93 mm when carrier type)
Length 95–300 mm
Thickness 0.07–2.0 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes) 
Production Management Management of equipment availability through production management monitoring screen
Options Available Communication interface  SECS-I/SECS-II, HSMS, GEM 
Utilities Input Power Supply Single Phase 100 VAC (±5% input variation)
50/60Hz (other voltage requires transformer) 
Power Consumption Approx. 1.3kVA
CDA  500kPa (5 kgf/cm2) 100L/min
Vacuum  -74kPa or below (-550 mmHg) (gauge) 
Physical Dimensions and Mass 1,222W × 964D × 2,087H mm  Approx.520 kg

※1 indicates the specifications of the upgraded version. Please contact our sales representative for details.
※2 Configuration and specifications of this machine are subject to partial modification without prior notice.

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