UTC-5000NeoCu
產品說明
High Speed Cu Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices.
- Capable of handling bare Cu wire and Pd coated Cu wire, achieving high speed bonding of 45ms/2mm
- Capable of high quality bonding with QFN devices and heavy Cu wire by installing a bonding head with a maximum bond force of 1000gf and high rigidity transducer
- Shorter product-type changeover time achieved by digitalizing the flow rate of inert gas
- Equipped with electric flame-off unit capable of handling wire sizes φ15-50μm without changing unit
- Enhanced portability with self-diagnostic function that optimizes servo parameters
- Capable of indexing 95mm x 300mm lead frames by allowing Y bonding area of 87mm
- Minimum detectable capacitance of 1pF achieved by AC nonsticking detector, allowing more advanced high precision nonsticking detection
- Capable of handling various types of devices with a variety of loop modes using Shinkawa ICP multi-loop mode technology and loop locus stabilization (XYZ control)（※）
- Facilitating the optimization of bonding parameters by automatic free air ball size setting
- Prevention of misplaced bonding by automatic bonding monitor function (BIM: Ball Inspection Measurement) that measures ball size and position, and feeds back information on positional deviation
- Correction of variations in ultrasonic output among machines by US current auto-correction function (UCAC)（※）
- Automatic free air ball monitor function (FAM) measuring free air ball size
- Capable of stable 35 μm pad pitch bonding with low vibration, high-speed drive using Shinkawa NRS technology
- Position correction function using temperature detection added to capillary tip position automatic correction through Shinkawa’s RPS technology（※）
- Maintenance work facilitated by automatic clamper calibration（※）
- Capable of handling large-size magazines by use of magazine stacker system
Specification
| ITEM | DETAILS | |
| Product Name | Wire Bonder | |
| Model | UTC-5000NeoCu | |
| Bonding Accuracy | ±2.0 μm（3σ）Using Shinkawa standard device | |
| Correction of Bonding Position | System to check and correct capillary offset prior to bonding through Shinkawa RPS (In combination with offset amount correction with temperature detection)（※） |
|
| Bonding Speed | 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device | |
| Bonding Wire Length | 8 mm maximum (Varies depending on device conditions) | |
| Resolution | XY-table: 0.1 μm Z-axis: 0.1 μm | |
| Vibration Control | Shinkawa NRS - Non Reaction Servo System | |
| Bonding Area | X：±28 mm, Y：±43.5 mm | |
| Wire Size | Au / Cu φ15–50 μm | |
| Bonding Force | 3–1,000gf | |
| No. of Bonding Wires | 30,000 wires maximum | |
| Loader/Unloader | Fully automatic magazine stacker system (Option: stocker system) | |
| Workpiece Size | Width | 20– 95 mm (20–93 mm when carrier type) |
| Length | 95–300 mm | |
| Thickness | 0.07–2.0 mm (Varies depending on type of device) （Conversion parts are required when thickness changes） |
|
| Production Management | Management of equipment availability through production management monitoring screen | |
| Options Available | Communication interface SECS-I/SECS-II, HSMS, GEM | |
| Utilities | Input Power Supply | Single Phase 100 VAC (±5% input variation) 50/60Hz (other voltage requires transformer) |
| Power Consumption | Approx. 1.3kVA | |
| CDA | 500kPa (5 kgf/cm2) 100L/min | |
| Vacuum | -74kPa or below (-550 mmHg) (gauge) | |
| Physical Dimensions and Mass | 1,222W × 964D × 2,087H mm Approx.520 kg | |
※1 indicates the specifications of the upgraded version. Please contact our sales representative for details.
※2 Configuration and specifications of this machine are subject to partial modification without prior notice.
