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  • YSB55w 1
  • YSB55w

YSB55w

產品說明

High-Speed & High-Accuracy Flip Chip Bonder

  • High-speed bonding through parallel processing enabled by a dual flip head and an 8-component synchronized bonding process
  • Outstanding positioning accuracy with a high-rigidity frame and control algorithms
  • Bump recognition camera for high-performance positioning alignment
  • Compact force control heads
  • Compatibility with a wide range of flip-chip sizes from 2mm square to 30mm square
  • Easy-to-configure Dipping station
Specification
ITEM DETAILS
Product Name Flip Chip Bonder
Model YSB55w
Applicable PCB  L260 × W200 - L50 × W50mm
PBC Thickness  0.2 - 3.0mm
PBC Transport Direction  Left to right (Option: right to left)
Bonding Capability  13,000 UPH (under optimal conditions, includes processing time)
Bonding Accuracy  ±5μm (3σ)
Component Supply Configuration  12 inch wafers
Applicable Components  □2 to 30 mm
Power Supply  3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz
Air Supply Source  0.5MPa or more, in clean, dry state
External Dimensions  L2,090 × D1,866 × H1,550mm (YSB55w main unit & wafer feed unit)
Weight  Approx. 3,500kg (YSB55w main unit & wafer feeder unit)

※ Specifications subject to change without prior notice.

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