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  • STC-800 1
  • STC-800

STC-800

產品說明

Discrete Application Die Bonder

  • Bonding accuracy ±20μm (3σ)
  • 10% increase in UPH compared with the conventional model
  • High-precision lead frame indexing utilizing linear drive
  • Capable of handling 86mm width frame, enabling to bond up to 76mm width Y bonding area
  • Equipped with a self-diagnostic system, providing long-term stable operation
  • Capable of handling several device conditions by the parameter settings of wafer tape expansion amount and the zoom function for the die recognition camera
Specification
ITEM DETAILS
Product Name Die Bonder
Model STC-800
Bonding Method Thermo-eutectic
Bonding Accuracy XY:±20μm (3σ),θ:±3°(3σ) based on bonding conditions at Shinkawa
Machine Cycle Time 0.140s / chip (at Y=40mm)
Average based on bonding conditions at Shinkawa
0.168s / chip UPH 21,400
Lead Frame Indexer Setting Temperature Room temperature - 500℃ (3ch control)
Wafer Tape Expansion Amount 5 - 15mm (variable)
Chip Size □0.12 - 1.5mm 
Wafer Size  Maximum 8-inch
Workpiece Size Width 20 – 86mm (maximum bonding area=76mm)
Length 120 – 260mm (maximum bonding area=10mm)
Thickness 0.1 - 0.4mm
Options Available Magazine loader stocker type
Utilities Input Power Supply Single phase AC 200V±5% 50 / 60Hz
(Other power supply options available on request)
Power Consumption 1.4kVA(1.3kW) Maximum
Air  400kPa (4kgf / cm2) 250L / min Connection:φ8 Tube 2 spots
N2 Gas 200 kPa (2 kgf / cm2) 10L / min Connection:φ6 Tube 1 spot
Forming Gas N2 95%+H2 5%
Vacuum Below -87kPa (-650mmHg) (gage) Connection:φ8 Tube 1 spot
Physical Dimensions and Mass Approx. 880W×1,050D×1,500H mm Approx. 1,160kg
(excludes monitor display and signal tower)

※ Configuration and specifications of this machine are subject to partial modification without prior notice.

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