STC-800
產品說明
Discrete Application Die Bonder
- Bonding accuracy ±20μm (3σ)
- 10% increase in UPH compared with the conventional model
- High-precision lead frame indexing utilizing linear drive
- Capable of handling 86mm width frame, enabling to bond up to 76mm width Y bonding area
- Equipped with a self-diagnostic system, providing long-term stable operation
- Capable of handling several device conditions by the parameter settings of wafer tape expansion amount and the zoom function for the die recognition camera
Specification
| ITEM | DETAILS | |
| Product Name | Die Bonder | |
| Model | STC-800 | |
| Bonding Method | Thermo-eutectic | |
| Bonding Accuracy | XY：±20μm (3σ)，θ：±3°(3σ) based on bonding conditions at Shinkawa | |
| Machine Cycle Time | 0.140s / chip (at Y=40mm) Average based on bonding conditions at Shinkawa 0.168s / chip UPH 21,400 |
|
| Lead Frame Indexer Setting Temperature | Room temperature - 500℃ (3ch control) | |
| Wafer Tape Expansion Amount | 5 - 15mm (variable) | |
| Chip Size | □0.12 - 1.5mm | |
| Wafer Size | Maximum 8-inch | |
| Workpiece Size | Width | 20 – 86mm (maximum bonding area＝76mm) |
| Length | 120 – 260mm (maximum bonding area＝10mm) | |
| Thickness | 0.1 - 0.4mm | |
| Options Available | Magazine loader stocker type | |
| Utilities | Input Power Supply | Single phase AC 200V±5% 50 / 60Hz (Other power supply options available on request) |
| Power Consumption | 1.4kVA(1.3ｋW) Maximum | |
| Air | 400kPa (4kgf / cm２) 250L / min Connection：φ8 Tube 2 spots | |
| N2 Gas | 200 kPa (2 kgf / cm２) 10L / min Connection：φ6 Tube 1 spot | |
| Forming Gas | N2 95%＋H2 5% | |
| Vacuum | Below -87kPa (-650mmHg) (gage) Connection：φ8 Tube 1 spot | |
| Physical Dimensions and Mass | Approx. 880W×1,050D×1,500H mm Approx. 1,160kg (excludes monitor display and signal tower) |
|
※ Configuration and specifications of this machine are subject to partial modification without prior notice.
