• LFB-1102Super 1
  • LFB-1102Super

LFB-1102Super

產品說明

Flip Chip Bonder for TCB process

  • It is the Chip to Substrate flip chip bonder for TCB process
  • High throughput achieved by 2 Head Modular structure
  • Capable of high-speed, high-accuracy flip chip bonding by adopting probe camera technology and linear motor that applies Shinkawa NRS technology
  • Both high precision force control and position control as well as high-force bonding achieved at bond head’s Z-axis by high/low force switching function
  • Cycle time reduced by short heating and cooling with high speed pulse heater
  • Capable of various plunge-up methods as well as thin die pickup and handling
  • Molten solder detection function and high-precision Z control reduce damage on devices (under low force mode)
  • Stable NCP pre-dispense application achieved by dispense amount feedback function
  • Process monitoring and management function securing stable quality and process portability
Specification
ITEM DETAILS
Product Name Flip Chip Bonder
Model LFB-1102Super
Bonding Method Pulse heat thermocompression
Bonding Accuracy ±2μm (3σ)　by Shinkawa’s standard condition
Machine Cycle Time  1.6s/chip (excludes process time) by Shinkawa’s standard condition
Bonding Force  1 - 300N
※Capable of selecting bond force control method at bonding process
  • Low force control mode：1 - 50N in 0.1N increments
  • High force control mode：10 - 300N in 1 N increments
Bonding Tool Setting Temperature  RT.- 400℃ (in 1℃ increments　pulse heat)
Bonding Stage Setting Temperature RT.-120℃ 
Chip Size □2 - 20mm　t = 0.05 - 0.7mm
Wafer Size Max.φ300mm
Workpiece Size Width 40 - 100mm (Maximum bonding area = 90mm)
Length 120 - 250mm (Maximum bonding area = 240mm)
Thickness 0.1 - 2.5mm
Option Available  Communication Interface　 SECS / GEM
Utilities Electricity Single Phase　AC200V±5％　50/60 Hz　30 A and higher
2spots required　(if other voltage, consult us)
Power Consumption 5.0kW Maximum
CDA 500kPa (5kgf / cm2) 250L/min　Connection：φ10　Tube　2spots
Vacuum Below -75kPa (gage)　Connection：φ10　Tube　4spots
Physical Dimensions and Mass Approx. 3,644W × 2,191D × 1,932H mm　Approx. 4,080kg
(excludes monitor display and signal tower)

※ Specifications are subject to change without prior notice.

回上層